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Optimization of an integrated and automated macro inspection system for the utilization of wafer color variation detection in a photolithography cluster [6152-130]

Author(s):
Lickteig, S. J. ( Tokyo Electron America, Inc. (USA) )
Forstner, T. W. ( Tokyo Electron America, Inc. (USA) )
Barnett, A. R. ( Tokyo Electron America, Inc. (USA) )
Dixon, D. S. ( Tokyo Electron America, Inc. (USA) )
Menon, V. C. ( IBM Microelectronics (USA) )
Isaacson, R. L. ( IBM Microelectronics (USA) )
Nicholls, M. C. ( IBM Microelectronics (USA) )
Liu, Y. ( Rudolph Technologies. Inc. (USA) )
Kinikouglu, P. ( Rudolph Technologies. Inc. (USA) )
4 more
Publication title:
Metrology, Inspection, and Process Control for Microlithography XX
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6152
Pub. Year:
2006
Pt.:
2
Page(from):
61523B
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461957 [0819461954]
Language:
English
Call no.:
P63600/6152
Type:
Conference Proceedings

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