Electron beam lithography for high aspect-ratio trench patterning in thick resist: experimental and simulation results [6151-118]

Electron beam lithography for high aspect-ratio trench patterning in thick resist: experimental and simulation results [6151-118]

Author(s):

Zhou J. ( Seagate Research Ctr. (USA) )
Xiao S. ( Seagate Research Ctr. (USA) )
Scholz W. ( Seagate Research Ctr. (USA) )
Yang X. ( Seagate Research Ctr. (USA) )

Publication title:

Emerging Lithographic Technologies X

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6151

Pub. Year:

2006

Pt.:

2

Page(from):

61513E

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819461940 [0819461946]

Language:

English

Call no.:

P63600/6151

Type:

Conference Proceedings

Details

TDL ID:	ZA00016183
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Emerging Lithographic Technologies
Conf. info. (Number):	2006 : 10th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2006.02.21-2006.02.23

Similar Items:

1 Conference Proceedings Electron-beam lithography method for sub-50-nm isolated trench with high aspect ratio Yang, X.M., Eckert, A.R., Mountfield, K., Gentile, H., Seiler, C., Brankovic, S., Harris, R., Johns, E. SPIE-The International Society for Optical Engineering	7 Conference Proceedings Simulation of resist heating in electron-beam lithography Babin,S.V., Kuzmin,I.Yu. SPIE-The International Society for Optical Engineering
2 Conference Proceedings Electron-beam lithography of isolated trenches with chemically amplified positive resist Eckert, A.R., Bojko, R.J., Gentile, H., Harris, R., Jayashankar, J., Johns, E., Minor, K., Mountfield, K., Seiler, C., … SPIE-The International Society for Optical Engineering	8 Conference Proceedings Novel resist and exposure strategy for high-resolution electron-beam lithography Daumann,W., Bertenburg,R.M., van den Berg,C., Tegude,F.-J. SPIE-The International Society for Optical Engineering
3 Conference Proceedings High-aspect-ratio resist for thick-film applications N.C. LaBianca, J.D. Gelorme Society of Photo-optical Instrumentation Engineers	9 Conference Proceedings Defect inspection for imprint lithography using a die to database electron beam verification system [6151-22] Myron, L. J, Thompson, McMackin, I., Resnick, D. J., Kitamura, T., Hasebe, T, Nakazawa, S, Tokumoto, T., Ainley, E., … SPIE - The International Society of Optical Engineering
4 Conference Proceedings Dry etching and boron diffusion of heavily doped high aspect ratio Si trenches Juan,W.-H., Weigold,J.W., Pang,S.W. SPIE-The International Society for Optical Engineering	10 Conference Proceedings Shrink assist film for enhanced resolution (SAFIER) process for printing of 20-nm trench with high aspect ratio Yang, X.M., Gentile, H. SPIE - The International Society of Optical Engineering
5 Conference Proceedings Pattern collapse in high-aspect-ratio DUV and 193-nm resists Domke,W.D., Graffenberg,V.L., Patel,S., Rich,G.K., Cao,H.B., Nealey,P.F. SPIE - The International Society for Optical Engineering	11 Conference Proceedings Layout optimization for thick-film resist overlay metrology L. Zhu, J. Li, B. Zhou, Y. Gu, S. Yang Society of Photo-optical Instrumentation Engineers
6 Conference Proceedings Resist charging in electron-beam lithography Bai,M., Picard,D.S., Tanasa,C., McCord,M.A., Berglund,C.N., Pease,R.F.W SPIE - The International Society for Optical Engineering	12 Conference Proceedings Fabrication of high-aspect-ratio microstructure on metallic substrate using SU-8 resist Liu, J., Cai, B., Zhu, J., Ding, G., Zhao, X., Yang, C., Chen, D. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12