Simulation analysis of printability of scratch and bump defects in EUV lithography [6151-32]

Simulation analysis of printability of scratch and bump defects in EUV lithography [6151-32]

Author(s):

Sugawara, M. ( Association of Super-Advanced Electronic Technologies (Japan) )
Nishiyama, I. ( Association of Super-Advanced Electronic Technologies (Japan) )

Publication title:

Emerging Lithographic Technologies X

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6151

Pub. Year:

2006

Pt.:

1

Page(from):

61510W

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819461940 [0819461946]

Language:

English

Call no.:

P63600/6151

Type:

Conference Proceedings

Details

TDL ID:	ZA00016183
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Emerging Lithographic Technologies
Conf. info. (Number):	2006 : 10th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2006.02.21-2006.02.23

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