From magic to technology: materials integration by wafer bonding (Invited Paper) [6123-42]

From magic to technology: materials integration by wafer bonding (Invited Paper) [6123-42]

Author(s):: Dragoi, V ( EY Group (Austria) )
Publication title:: Integrated Optics: Devices, Materials, and Technologies X
Title of ser.:: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:: 6123
Pub. Year:: 2006
Page(from):: 612314
Pub. info.:: Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:: 0277786X
ISBN:: 9780819461650 [0819461652]
Language:: English
Call no.:: P63600/6123
Type:: Conference Proceedings

Details

TDL ID:	ZA00016157
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Optoelectronic Materials and Devices : Integrated Optics
Conf. info. (Number):	2006 : 10th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2006.01.23-2006.01.25

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