Height inspection of wafer bumps without explicit 3D reconstruction[6070-04]

Author(s):

• Dong M ( The Chinese Univ. of Hong Kong (Hong Kong China); )
• Chung R ( The Chinese Univ. of Hong Kong (Hong Kong China); )
• Zhao Y ( The Chinese Univ. of Hong Kong (Hong Kong China); )
• Lam E Y ( Univ.of Hong Kong (Hong Kong China) )

Publication title:

Machine Vision Applications in Industrial Inspection XIV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6070

Pub. Year:

2006

Page(from):

607004

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819461100 [0819461105]

Language:

English

Call no.:

P63600/6070

Type:

Conference Proceedings