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Fabrication of phone-camera module using wafer-scale UV embossing process [6068-28]

Author(s):
Shin, D. I. ( Samsung Electro-Mechanics (South Korea) )
Kim, S. H. ( Samsung Electro-Mechanics (South Korea) )
Jeong, H. S. ( Samsung Electro-Mechanics (South Korea) )
Lee, S. ( Samsung Electro-Mechanics (South Korea) )
Jin, Y. ( Samsung Electro-Mechanics (South Korea) )
Noh, J. ( Samsung Electro-Mechanics (South Korea) )
Oh, H ( Samsung Electro-Mechanics (South Korea) )
Lee, K ( Samsung Electro-Mechanics (South Korea) )
Shin, D. H. ( Samsung Electro-Mechanics (South Korea) )
Song, S. H. ( Hanyang Univ (South Korea) )
5 more
Publication title:
Sensors, Cameras, and Systems for Scientific/Industrial Applications VII
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6068
Pub. Year:
2006
Page(from):
60680Q
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461087 [0819461083]
Language:
English
Call no.:
P63600/6068
Type:
Conference Proceedings

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