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Study on the packaging integrity testing for polymer micro-device [6040-10]

Author(s):
Publication title:
ICMIT 2005: mechatronics, MEMS, and smart materials : 20-23 September 2005, Changchun, China
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6040
Pub. Year:
2005
Page(from):
60400A
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819460721 [0819460729]
Language:
English
Call no.:
P63600/6040
Type:
Conference Proceedings

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