Study of low temperature GaAs/InP wafer bonding [6020-17]

Study of low temperature GaAs/InP wafer bonding [6020-17]

Author(s):

Wang X.
Huang H.
Wang Q.
Ren X.
Huang Y. ( Beijing Univ. of Posts and Telecommunications (China) )

Publication title:

Optoelectronic Materials and Devices for Optical Communications

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6020

Pub. Year:

2005

Page(from):

60200I

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819460516 [0819460516]

Language:

English

Call no.:

P63600/6020

Type:

Conference Proceedings

Details

TDL ID:	ZA00016055
Series ID:	PA00000029
Conf. info. (Name):	APOC : Asia Communications and Photonics
Conf. info. (Number):	2005
Conf. info. (Venue):	Shanghai, China
Conf. info. (Date):	2015.11.07-2015.11.10

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