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Self-assembled porous silica/Cu damascene interconnects for 45nm node and beyond (invited Papre) [6002-23]

Author(s):
Kikkawa T. ( Hiroshima Univ. (Japan) and National Institute of Advance Industrial Science and Technology (Japan) )
Yagi R.
Chikaki S.
Shimoyama M.
Ono T.
Fujii N.
Kohmura K.
Tanaka H.
Nakayama T.
Ishikawa A.
Motsuo H.
Sonoda Y.
Hata N.
Seino Y.
Yoshino T.
10 more
Publication title:
Nanofabrication: Technologies, Devices, and Applications II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6002
Pub. Year:
2005
Page(from):
60020M
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819460264 [0819460265]
Language:
English
Call no.:
P63600/6002
Type:
Conference Proceedings

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