VI. System Integration Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization

VI. System Integration Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization

Author(s):

Publication title:

Advanced structural and functional materials design : proceedings of the International Symposium on Advanced Structural and Functional Materials Design, Osaka, Japan, November 10th-12th, 2004

Title of ser.:

Materials science forum

Ser. no.:

512

Pub. Year:

2006

Page(from):

355

Page(to):

360

Pages:

6

Pub. info.:

Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499960 [0878499962]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00015821
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Advanced Structural and Functional Materials Design
Conf. info. (Number):	2004
Conf. info. (Venue):	Osaka, Japan
Conf. info. (Date):	2004.11.10-2004.11.12

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