TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Author(s):

Publication title:

Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China

Title of ser.:

Materials science forum

Ser. no.:

510-511

Pub. Year:

2006

Page(from):

554

Page(to):

557

Pages:

4

Pub. info.:

Uetikon-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499953 [0878499954]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00015820
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Eco-materials Processing & Design
Conf. info. (Number):	7th
Conf. info. (Venue):	Chengdu, China
Conf. info. (Date):	2006.01.08-2006.01.11

Similar Items:

1 Conference Proceedings Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging Yoon, J.W., Lee, C.B., Jung, S.B. Trans Tech Publications	7 Conference Proceedings Effects of In/Ce to Sn-3.5Ag Lead-Free Solder on Microstructures and Properties E.J. Chen, X.C. Zhao, Y. Liu, D.M. Li, J.W. Cheng Trans Tech Publications
2 Conference Proceedings Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow Yoon, J. W., Kim, S. W., Jung, S. B. Trans Tech Publications	8 Conference Proceedings Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder Y. Wang, X.C. Zhao, Y. Liu, J.W. Cheng, H. Li Trans Tech Publications
3 Conference Proceedings Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints Kim, J.W., Yoon, J.W., Jung, S.B. Trans Tech Publications	9 Conference Proceedings Effect of Zn Addition on the Interfacial Reactions Between Cu and Lead-Free Solders Su-Chun Yang, Cheng-En Ho, Chien-Wei Chang, C. Robert Kao Materials Research Society
4 Conference Proceedings Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps Kim, D.G., Ha, S.S., Jung, S.B. Trans Tech Publications	10 Conference Proceedings Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface H. Tsukamoto, Z.G. Dong, H. Huang, T. Nishimura, K. Nogita Trans Tech Publications
5 Conference Proceedings A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM Choi, J.K., Kang, H.B., Lee, J.W., Jung, S.B., Yang, C.W. Trans Tech Publications	11 Conference Proceedings Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging Kim, D. G., Jang, H. S., Kim, Y. J., Jung, S. B. Trans Tech Publications
6 Conference Proceedings Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength Kim, J.W., Jung, S.B. Trans Tech Publications	12 Conference Proceedings Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder R. Mayappan, N.N. Zainal Abidin, N.A. Ab Ghani, I. Yahya, N. Shuhaime Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12