A Fundamental Modeling Approach for Nano-Grinding of Silicon Wafers

A Fundamental Modeling Approach for Nano-Grinding of Silicon Wafers

Author(s):

Publication title:

Progress on advanced manufacture for micro/nano technology 2005 : proceedings of the 2005 International Conference on Advanced Manufacture Taipei, Taiwan, R.O.C. November 28th-December 2nd, 2005

Title of ser.:

Materials science forum

Ser. no.:

505-507

Pub. Year:

2006

Pt.:

1

Page(from):

253

Page(to):

258

Pages:

6

Pub. info.:

Uetikon-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499908 [0878499903]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00015816
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Advanced Manufacture
Conf. info. (Number):	2005
Conf. info. (Venue):	Taipei, Taiwan, R.O.C.
Conf. info. (Date):	2005.11.28-2005.12.02

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