Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

Author(s):

Publication title:

New frontiers of processing and engineering in advanced materials : proceedings of the International Conference on New Frontiers of Process Scinence and Engineering in Advanced Materials : The 14th Iketani Conference, November, 24-26, 2004, held in Kyoto, Japan

Title of ser.:

Materials science forum

Ser. no.:

502

Pub. Year:

2005

Page(from):

399

Page(to):

404

Pages:

6

Pub. info.:

Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499809 [0878499806]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00015814
Series ID:	PA00000012
Conf. info. (Name):	International Conference on New Frontiers of Process Scinence and Engineering in Advanced Materials ; Iketani Conference
Conf. info. (Number):	2004 ; 14th
Conf. info. (Venue):	Kyoto, Japan
Conf. info. (Date):	2004.11.24-2004.11.26

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