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MICROELE CTRONICS AND MICROJOINING Selection of Proper Fatigue Model for Flip Chip Package Reliability

Author(s):
Shin, Y.E.
Kim, Y.S.
Kim, H.I.
Kim, J.M.
Chang, K.H.
Parson, D.F.
1 more
Publication title:
New frontiers of processing and engineering in advanced materials : proceedings of the International Conference on New Frontiers of Process Scinence and Engineering in Advanced Materials : The 14th Iketani Conference, November, 24-26, 2004, held in Kyoto, Japan
Title of ser.:
Materials science forum
Ser. no.:
502
Pub. Year:
2005
Page(from):
393
Page(to):
398
Pages:
6
Pub. info.:
Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499809 [0878499806]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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