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Real Time Study of Cu Diffusion Through a Ru Thin Film by Photoemissions Electron Microscopy (PEEM)

Author(s):
Wei, Wei
Xiong, Gang
Sun, Y.-M.
Joly, Alan G.
Beck, Kenneth M.
White, J.M.
Hess, Wayne P.
2 more
Publication title:
Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
914
Pub. Year:
2006
Page(from):
185
Page(to):
190
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998705 [1558998705]
Language:
English
Call no.:
M23500/914
Type:
Conference Proceedings

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