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THE EFFECT OF COPPER ON THE TITANIUM-SILICON DIOXIDE REACTION AND THE IMPLICATIONS FOR SELF-ENCAPSULATING, SELF-ADHERING METALLIZATION LINES

Author(s):
Publication title:
Materials reliability in microelectronics II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
265
Pub. Year:
1992
Page(from):
205
Page(to):
210
Pages:
6
Pub. info.:
Pittsburgh, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558991606 [1558991603]
Language:
English
Call no.:
M23500/265
Type:
Conference Proceedings

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