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FLUORINATED PARYLENE AS AN INTERLAYER DIELECTRIC FOR THIN FILM MCM"S

Author(s):
Dabral, S.
Zhang, X.
Wu, X. M.
Yang, G.-R.
Langm C.-I.
Bakhru, H.
Olson,R.
Lu, T.-M.
McDonald, J. F
4 more
Publication title:
Electronic packaging materials science VI : symposium held April 27-30, 1992, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
264
Pub. Year:
1992
Page(from):
83
Page(to):
90
Pages:
8
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991699 [1558991697]
Language:
English
Call no.:
M23500/264
Type:
Conference Proceedings

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