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THE FORMATION OF TiN-ENCAPSULATED Cu INTERCONNECTS

Author(s):
Li, Jian
Straine, J. W.
Russell, S. W.
Chapman, P.
Shachm-Diamand Y.
Mayer, J. W.
1 more
Publication title:
Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
260
Pub. Year:
1992
Page(from):
605
Page(to):
610
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991552 [1558991557]
Language:
English
Call no.:
M23500/260
Type:
Conference Proceedings

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