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THERMAL STRESS INDUCED VOID FORMATION IN NARROW PASSIVATED Cu LINES

Author(s):
Publication title:
Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
239
Pub. Year:
1992
Page(from):
701
Page(to):
706
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991330 [1558991336]
Language:
English
Call no.:
M23500/239
Type:
Conference Proceedings

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