EFFECT OF STRESSES ON VOID NUCLEATION DURING ELECTROMIGRATION
- Author(s):
- Publication title:
- Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 239
- Pub. Year:
- 1992
- Page(from):
- 689
- Page(to):
- 694
- Pages:
- 6
- Pub. info.:
- Pittsburgh, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558991330 [1558991336]
- Language:
- English
- Call no.:
- M23500/239
- Type:
- Conference Proceedings
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