*MECHANISMS OF INELASTIC DEFORMATION AND STRESS RELAXATION IN THIN METALLIZATIONS BONDED TO HARD SUBSTRATES

*MECHANISMS OF INELASTIC DEFORMATION AND STRESS RELAXATION IN THIN METALLIZATIONS BONDED TO HARD SUBSTRATES

Author(s):

Publication title:

Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

226

Pub. Year:

1991

Page(from):

391

Page(to):

400

Pages:

10

Pub. info.:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558991200 [1558991204]

Language:

English

Call no.:

M23500/226

Type:

Conference Proceedings

Details

TDL ID:	ZA00015710
Series ID:	PA00000011
Conf. info. (Name):	Symposium on mechanical behavior of materials and structures in microelectronics
Conf. info. (Number):	1991
Conf. info. (Venue):	Anaheim, CA, USA
Conf. info. (Date):	1991.04.30-1991.05.03

Similar Items:

1 Conference Proceedings *MECHANISMS OF INELASTIC DEFORMATION AND STRESS RELAXATION IN THIN METALLIZATIONS BONDED TO HARD SUBSTRATES Korhonen, M. A., Borgesen, P., Li, Che-Yu Materials Research Society	7 Conference Proceedings THE EFFECT OF LINE GEOMETRY ON VOID GROWTH IN THIN, NARROW ALUMINUM LINES Borgesen, P., Lee, J. K., Korkohen, M. A., Li, C. -Y. Materials Research Society
2 Conference Proceedings VOID GROWTH AS A FUNCTION OF RESIDUAL STRESS LEVEL IN THIN, NARROW ALUMINUM LINES Korkohen, M. A., Borgesen, P., Paszkiet, C. A., Lee, J. K., Li, Che-Yu Materials Research Society	8 Conference Proceedings THE EFFECT OF THERMALLY INDUCED STRESSES ON ELECTROMIGRATION LIFETIME OF NEAR-BAMBOO INTERCONNECTS Korhonen, M. A., Borgesen, P., Brown, D. D., Li, Che-Yu MRS - Materials Research Society
3 Conference Proceedings THE EFFECT OF A PASSIVATION OVER-LAYER ON THE MECHANISMS OF STRESS RELAXATION IN CONTINUOUS FILMS AND NARROW LINES OF ALUMINUM Paszkiet, C. A., Korkohen, M. A., Li, Che-Yu Materials Research Society	9 Conference Proceedings THE EFFECT OF A PASSIVATION OVER-LAYER ON THE MECHANISMS OF STRESS RELAXATION IN CONTINUOUS FILMS AND NARROW LINES OF ALUMINUM Paszkiet, C. A., Korhonen, M. A., Li, Che-Yu Materials Research Society
4 Conference Proceedings ESTIMATION OF THERMAL STRESSES AND STRESS CONCENTRATION IN CONFINED INTERCONNECTLINES OF RECTANGULAR CROSS SECTION Korhonen, M. A., Borgesen, P., Li, Che-Yu Materials Research Society	10 Conference Proceedings STRESS INDUCED VOID NUCLEATION IN NARROW ALUMINUM ALLOY LINES Borgesen, P., Korkohen, M. A., Basa, C., LaFontaine, W. R., Land, B., Li, C. -Y. Materials Research Society
5 Conference Proceedings ELECTROMIGRATION IN ALUMINUM BASED INTERCONNECTS OF VLSI-MICROCIRCUITS, WITH AND WITHOUT PRECEDING STRESS-MIGRATION DAMAGE Korhonen, M. A., Borgesen, P., Li, Che-Yu Materials Research Society	11 Conference Proceedings MEASUREMENT OF STRESS RELAXATION IN THIN ALUMINUM METALLIZATIONS BY CONTINUOUS INDENTATION AND X-RAY TECHNIQUES Korhonen, M. A., LaFontaine, W. R., Paszkiet, C. A., Black, R. D., Li, Che-Yu Materials Research Society
6 Conference Proceedings VOID GROWTH AS A FUNCTION OF RESIDUAL STRESS LEVEL IN THIN, NARROW ALUMINUM LINES Korhonen, M. A., Borgesen, P., Paszkiet, C. A., Lee, J. K., Li, Che-Yu Materials Research Society	12 Conference Proceedings INDENTATION LOAD RELAXATION STUDIES OF THIN FILM-SUBSTRATE SYSTEMS Stone, D., LaFontaine, W., Ruoff, S., Hannula, S.-P., Yost, B., Li, Che-Yu Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12