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FRACTURE BEHAVIOR OF SILICON CUT WITH A HIGH POWER LASER

Author(s):
Chao, C. C.
Chleboski, R.
Henderson, E. J.
Holmes, C. K.
Kalejs, J. P.
Gross, T. S.
1 more
Publication title:
Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
226
Pub. Year:
1991
Page(from):
363
Page(to):
368
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991200 [1558991204]
Language:
English
Call no.:
M23500/226
Type:
Conference Proceedings

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