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INTERMETALLIC REACTIONS BETWEEN COPPER AND MAGNESIUM AS AN ADHESION/BARRIER LAYER

Author(s):
Publication title:
Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
225
Pub. Year:
1991
Page(from):
231
Page(to):
236
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991194 [1558991190]
Language:
English
Call no.:
M23500/225
Type:
Conference Proceedings

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