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EVALUATION ON ELECTROMIGRATION AND STRESSMIGRATION OF METAL INTERCONNECTIONS BY HARDNESS MEASUREMENTS

Author(s):
Nakagawa, T.
Miyatake, H.
Maeda, T.
Kuroda, K.
Tokushige, N.
Inoue, R.
Kudo, J.
Ashida, T.
3 more
Publication title:
Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
225
Pub. Year:
1991
Page(from):
167
Page(to):
176
Pages:
10
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991194 [1558991190]
Language:
English
Call no.:
M23500/225
Type:
Conference Proceedings

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