ELECTROMIGRATION LIFETIME AND STEP COVERAGE IN Al/Cu/Si THIN FILM CONDUCTORS

ELECTROMIGRATION LIFETIME AND STEP COVERAGE IN Al/Cu/Si THIN FILM CONDUCTORS

Author(s):

Publication title:

Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

225

Pub. Year:

1991

Page(from):

107

Page(to):

112

Pages:

6

Pub. info.:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558991194 [1558991190]

Language:

English

Call no.:

M23500/225

Type:

Conference Proceedings

Details

TDL ID:	ZA00015709
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials reliability issues in microelectronics
Conf. info. (Number):	1991
Conf. info. (Venue):	Anaheim, CA, USA
Conf. info. (Date):	1991.04.30-1991.05.03

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