Blank Cover Image

A STATISTICAL CHARACTERIZATION OF ELECTROMIGRATION INDUCED OPEN FAILURES IN 2-LEVEL METAL STRUCTURES

Author(s):
Publication title:
Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
225
Pub. Year:
1991
Page(from):
15
Page(to):
20
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991194 [1558991190]
Language:
English
Call no.:
M23500/225
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings RELIABILITY OF INTERCONNECTS EXHIBITING BIMODAL ELECTROMIGRATION-INDUCED FAILURED DISTRIBUTIONS

Kahn, H., Thompson, C. V., Cooperman, S. S.

Materials Research Society
7 Conference Proceedings Statistical Modeling and Experimental Verification of Electromigration Time to Fail Distribution in Metal Interconnects

Capasso, C., Gall, M., Anderson, S., Jawarani, D., Hernandez, R., Kawasaki, H.

Electrochemical Society
2 Conference Proceedings Multi-Via Electromigration Test Structures for Identification and Characterization of Different Failure Mechanisms

Choi, Z.-S., Chang, C.W., Lee, J.H., Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K.

Materials Research Society
8 Conference Proceedings Characterization of Electromigration Failures Using a Novel Test Structure

Gall, Martin, Jawarani, Dharmesh, Kawasaki, Hisaso

MRS - Materials Research Society
3 Conference Proceedings Electromigration Failure Modes in CU Metallization*

Gall, M., Capasso, C., Thrasher, S., Zhao, L., Muiski, P., Hernandez, R., Herrick, M., Angyal, M., Boeck, B., Kawasaki, …

Electrochemical Society
9 Conference Proceedings Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

Lin, Y. H., Tsai, C. M., Hu, Y. C., Lin, Y. L., Tsai, J. Y., Kao, C. R.

Trans Tech Publications
4 Conference Proceedings A Comparative Study on Electromigration Failure Mechanism Between Near-Bamboo and Bamboo Al(Cu) Two-Level Structure

Wang, P.-H., Lee, C., Jawarani, D., Kawasaki, H., Ho, P. S.

MRS - Materials Research Society
10 Conference Proceedings Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects

Nichols,C.S., Smith,D.A.

Trans Tech Publications
5 Conference Proceedings Stress Voiding and Electromigration Failure in Multilevel Interconnect Metallization

Ho, P.S., Anderson, S.G.H., Yeo, I.S., Hu, C.K.

Electrochemical Society
11 Conference Proceedings Bricks and Open-Shell Buildings in Molecular Magnetism

Kahn O.

Kluwer Academic Publishers
6 Conference Proceedings The Effect of Test Structure and Stress Condition on Electromigration Failure

Kawasaki, H., Lee, C., Pintchovski, F.

Electrochemical Society
12 Conference Proceedings The Electromigration and Failure Behaviour in Layered Tungsten Via Structures

Elliott, L. J., Spooner, T., Rose, J. H., Shuman, R.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12