THE PRECIPITATION OF NICKEL AND COPPER AT GRAIN BOUNDARIES IN SILICON

THE PRECIPITATION OF NICKEL AND COPPER AT GRAIN BOUNDARIES IN SILICON

Author(s):

Publication title:

Defects in materials : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

209

Pub. Year:

1991

Page(from):

409

Page(to):

414

Pages:

6

Pub. info.:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558991019 [1558991018]

Language:

English

Call no.:

M23500/209

Type:

Conference Proceedings

Details

TDL ID:	ZA00015693
Series ID:	PA00000011
Conf. info. (Name):	Symposium on defects in materials
Conf. info. (Number):	1990
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1990.11.26-1990.11.29

Similar Items:

1 Conference Proceedings PRECIPITATION OF COPPER AND COBALT AT GRAIN BOUNDARIES IN SILICON Jenrich, U., Moller, H.J. Materials Research Society	7 Conference Proceedings Precipitation of Copper Silicide at Grain Boundary in Silicon Abdelaoui,R., Nouet,G., Allais,G. Trans Tech Publications
2 Conference Proceedings TEM AND HREM INVESTIGATION OF THE PRECIPITATION OF COBALT AND NICKEL IN POLYCRYSTALLINE SILICON Moller, H. J., Chung, Juyong, Huang, Lan Materials Research Society	8 Conference Proceedings HREM Study of Copper Precipitation in a ｦｲ=25 Silicon Tilt Grain Boundary Elkajbaji,M., Thibault,J. Trans Tech Publications
3 Conference Proceedings INVESTIGATION OF THE COBALT SEGREGATION AND THE STRUCTURE OF A GRAIN BOUNDARY IN SILICON' Tutken, T., Schroter, W., Moller, H.J. Materials Research Society	9 Conference Proceedings *GRAIN BOUNDARY SEGREGATION AND PRECIPITATION PROCESSES IN IRON AND NICKEL BASE ALLOYS Hall, Ernest L., Briant, Clyde L. Materials Research Society
4 Conference Proceedings A TEM INVESTIGATION OF SECONDARY DISLOCATINS IN GRAIN BOUNDARIES IN GERMANIUM Griess, M., Seibt, M., Moller, H.J. Materials Research Society	10 Conference Proceedings Grain Boundary Segregation in Iron and its Alloys and its Effects on Intergranular Fracture Briant,C.L., Grabke,H.J. Trans Tech Publications
5 Conference Proceedings CHARGED DEFECT STATES AT SILICON GRAIN BOUNDARIES. STUTZLER,F.J., TAPFER,L., QUEISSER,H.J. Trans Tech Publications	11 Conference Proceedings Grain Boundary Void Formation during Oxidation of Alloys and Intermetallics Katsman,A.V., Grabke,H.J., Levin,L., Werber,T. Trans Tech Publications
6 Conference Proceedings Transport across silicon grain boundaries Werner, J., Jantsch, W., Froehner, K.H., Queisser, H.J. North-Holland	12 Conference Proceedings FORMATION OF MICRO-PRECIPITATES AT THE MELT-SOLID INTERFACE IN SEMICONDUCTORS Moller, H.J. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12