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EFFECT OF OXYGEN EXPOSURE AND DEPOSITION ENVIRONMENT ON THERMAL STABILITY OF Ta BARRIERS TO Cu PENETRATION

Author(s):
Bojarczuk, N.A.
Clevenger, L.A.
Holloway, K.
Harper, J.M.E.
Cabral, C.
Schad, R.G.
Stolt, L.
2 more
Publication title:
Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
203
Pub. Year:
1991
Page(from):
387
Page(to):
394
Pages:
8
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558990951 [155899095X]
Language:
English
Call no.:
M23500/203
Type:
Conference Proceedings

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