DIFFUSION AND ADHESION OF Cu/PARYLENE
- Author(s):
Yang, G. Dabral, S. You, L. Bakhru, H. McDonald, J.F. Lu, T.-M. - Publication title:
- Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 203
- Pub. Year:
- 1991
- Page(from):
- 271
- Page(to):
- 276
- Pages:
- 6
- Pub. info.:
- Pittsburgh, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558990951 [155899095X]
- Language:
- English
- Call no.:
- M23500/203
- Type:
- Conference Proceedings
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