EFFECT OF RF SPUTTERING ON T/H SUSCEPTIBILITY OF Cr/POLYIMIDE ADHESION
- Author(s):
- Publication title:
- Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 203
- Pub. Year:
- 1991
- Page(from):
- 65
- Page(to):
- 70
- Pages:
- 6
- Pub. info.:
- Pittsburgh, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558990951 [155899095X]
- Language:
- English
- Call no.:
- M23500/203
- Type:
- Conference Proceedings
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