Blank Cover Image

NEW PHOTOSENSITIVE POLYMIDE (SIM2000XL-RTS) FOR PACKAGING APPLICATIONS

Author(s):
Publication title:
Advanced electronic packaging materials : symposium held November 27-29, 1989, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
167
Pub. Year:
1990
Page(from):
111
Page(to):
116
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558990555 [1558990550]
Language:
English
Call no.:
M23500/167
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings CROSSLINKING AND CHAIN-SCISSION OF PHOTOSENSITIVE POLYIMIDESILOXANE UNDER DEEP UV IRRADIATION

Jeng, S., Xu, M., Kwok, H.S., Tang, D.Y., Acharya, H.R., Rosenfeld, J.C.

Materials Research Society
7 Conference Proceedings The Nanohardness of Acicular Ferrite and Bainitic Ferrite in Low Carbon Microalloying Steel

C.J. Shang, X. Liang, X.M. Wang, X.L. He, H. Liu

Trans Tech Publications
2 Conference Proceedings New High Barrier, Oxygen Scavenging Polymides for Packaging Applications

Socci, E. P., Akkapeddi, M. K., Worley, D. C.

Society of Plastics Engineers
8 Conference Proceedings Voltammetric Measurement of Al2O3 Film Dissolutions Kinetics in Aqueous Chloride Solutions

Lee, S., Boxicy, C.J., White, H.S.

Electrochemical Society
3 Conference Proceedings Liquid crystalline polyacetylenes:a new class of mesomorphic materials with novel optical and electronic properties

Tang,B.Z., Lam,J.W.Y., Kong,X., Lee,P.P.S., Wan,X., Kwok,H.S., Huang,Y.M., Ge,W., Chen,H., Xu,R., Wang,M.

SPIE - The International Society for Optical Engineering
9 Conference Proceedings New Cu-Based Bulk Metallic Glasses with High Strength of 2000 MPa

Shin, S.Y., Kim, J.H., Lee, D.M., Lee, J.K., Kim, H.J., Jeong, H.G., Bae, J.C.

Trans Tech Publications
4 Conference Proceedings Study on the photosensitivity of photosensitive fibers

Zhang, D., Jiang, L., Ren, Q., Li, J., Zhou, C., Liu, S., Jiang, D., Kai, G., Dong, X.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings UV photosensitivity in PECVD-grown germanosilicate waveguides

Moss,D.J., Bazylenko,M.V., Gross,M., Chu,P.L., Faith,M., Leech,P.W., Kemeny,P., Ibsen,M., Leistiko,O., Poulson,C.V., …

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Polyacetylene liquid crystals: new mesomorphic materials with high thermal stability and novel light-emitting properties

Tang, B.Z., Lam, J.W.Y., Lai, L.M., Xie, Z., Kwok, H.S.

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Mechanism of endogenetic chromophore mediated photo-damage and its applications [6026-09]

Liu T. C.-Y., Liu J., Cui L.-P., Xu X.-Y., Lu J., Liu S.-H.

SPIE - The International Society of Optical Engineering
6 Conference Proceedings The RTS2 Protocol

P. Kubánek, M. Jelínek, J. French, M. Prouza, S. Vitek

Society of Photo-optical Instrumentation Engineers
12 Conference Proceedings Inspection system for microelectronics BGA package using wavelength scanning interferometry

Kang,C.M., Woo,H.G., Cho,H.S., Hahn,J.W., Lee,J.Y.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12