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*SOLVENT AND CURING EFFECTS ON DIFFUSION AT POLYIMIDE INTERFACES

Author(s):
Publication title:
Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
154
Pub. Year:
1989
Page(from):
283
Page(to):
292
Pages:
10
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558990272 [1558990275]
Language:
English
Call no.:
M23500/154
Type:
Conference Proceedings

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