LASER SURFACE MODIFICATION FOR COPPER DEPOSITION ON POLYIMIDE

LASER SURFACE MODIFICATION FOR COPPER DEPOSITION ON POLYIMIDE

Author(s):

Publication title:

Laser and particle-beam chemical processes on surfaces : symposium held November 29-December 2, 1988, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

129

Pub. Year:

1989

Page(from):

579

Page(to):

584

Pages:

6

Pub. info.:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558990029 [155899002X]

Language:

English

Call no.:

M23500/129

Type:

Conference Proceedings

Details

TDL ID:	ZA00015614
Series ID:	PA00000011
Conf. info. (Name):	Symposium on laser and particle-beam chemical processes on surfaces
Conf. info. (Number):	1988
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1988.11.29-1988.12.02

Similar Items:

1 Conference Proceedings *AREA-SELECTIVE LASER PROCESSING TECHNIQUES FOR MULTICHIP INTERCONNECT Liu, Y.S., Cole, H.S. Materials Research Society	7 Conference Proceedings Selectively deposited copper on laser-treated polyimide using electroless plating Zhao,G., Phillips,H.M., Zheng,H., Tam,S.-C., Liu,W., Wen,G., Gong,Z., Lam,Y.-L. SPIE - The International Society for Optical Engineering
2 Conference Proceedings *LA5ER-BASED AREA-SELECTIVE PROCESSING TECHNIQUES FOR HIGH-DENSITY INTERCONNECTS Liu, Y.S., Cole, H.S. Materials Research Society	8 Conference Proceedings Selective deposition of conductive copper films on glass surfaces using femtosecond laser surface modification and electroless plating J. Xu, Y. Liao, H. Zeng, Z. Zhou, H. Sun Society of Photo-optical Instrumentation Engineers
3 Conference Proceedings Polymer-based optical interconnect technology: a route to low-cost optoelectronic packaging and interconnect Y.S. Liu, H.S. Cole, J.P. Bristow, Y. Liu Society of Photo-optical Instrumentation Engineers	9 Conference Proceedings MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging Bristow,J.P., Liu,Y., Marta,T., Johnson,K., Hanzal,B.R., Peczalski,A., Bounnak,S., Liu,Y.S., Cole,H.S. SPIE-The International Society for Optical Engineering
4 Conference Proceedings Pretreatment and Deposition of Copper on Polyimide for Flexible Copper Clad Laminate Using Vacuum Web Sputtering System J. Cho, B.J. Kim, Y.S. Kim, H.W. Choi, W.K. Choi Society of Vacuum Coaters	10 Conference Proceedings Surface Modification of Polyimide Films by Laser Processing and Electrically Conducting Polymers Dao, L. H., Menikh, A., Paynter, R., Martin, F. Society of Plastics Engineers, Inc. (SPE)
5 Conference Proceedings LASER-INDUCED SELECTIVE COPPER DEPOSITION ON POLYIMIDES AND SEMICONDUCTORS Hwang, Seong-Don, Kher, S.S., Spencer, J.T., Dowben, P.A. Materials Research Society	11 Conference Proceedings CRYSTALLINE POLYIMIDE THIN FILM DEPOSITION BY IONIZED CLUSTER BEAM Cho, S.J., Choe, H.S., Jang, H.G., Kim, S.S., Whang, C.N. Materials Research Society
6 Conference Proceedings Laser-induced modification in YBCO target surface Jeong,Y.S., Lee,S.Y. SPIE-The International Society for Optical Engineering	12 Conference Proceedings Surface Modification of High-Copper Aluminum Alloys Mansfeld, F., Wang, Y., Lin, S.H. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12