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STRESSES IN ANISOTROPIC THIN FILMS BONDED TO STIFF SUBSTRATES

Author(s):
Publication title:
Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
108
Pub. Year:
1988
Page(from):
399
Page(to):
406
Pages:
8
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837760 [0931837766]
Language:
English
Call no.:
M23500/108
Type:
Conference Proceedings

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