*MATERIALS FOR HIGH SPEED CIRCUIT BOARDS

*MATERIALS FOR HIGH SPEED CIRCUIT BOARDS

Author(s):

Publication title:

Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

108

Pub. Year:

1988

Page(from):

141

Page(to):

152

Pages:

12

Pub. info.:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9780931837760 [0931837766]

Language:

English

Call no.:

M23500/108

Type:

Conference Proceedings

Details

TDL ID:	ZA00015594
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	3rd
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1987.11.30-1987.12.04

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