Blank Cover Image

PLASMA MODE TRENCH ETCHING WITH DIRECT HYDROCARBON INJECTION

Author(s):
Publication title:
Plasma processing : symposium held April 15-18, 1986, Palo Alto, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
68
Pub. Year:
1986
Page(from):
21
Page(to):
28
Pages:
8
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837340 [0931837340]
Language:
English
Call no.:
M23500/68
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings *FACTORS AFFECTING CHARGING DAMAGE DURING PLASMA ETCHING

McVittie, J.P.

Electrochemical Society
7 Conference Proceedings Limitations of Plasma Charging Damage Measurements Using MOS Capacitor Structures

Ma, Shawming, Abdel-Ati, Wael L. N., McVittie, James P.

MRS - Materials Research Society
2 Conference Proceedings THE ROLE OF * ANTENNA * STRUCTURE ON THIN OXIDE DAMAGE FROM PLASMA INDUCED WAFER CHARGING

Fang, Sychyi, McVittie, James P.

Materials Research Society
8 Conference Proceedings Feedback Control of Plasma Etching

Christofides, Panagiotis D., Baker, James

American Institute of Chemical Engineers
3 Conference Proceedings Modeling of Aspect Ratio Dependent Etching in an Inductively Coupled Plasma

Han, J. S., Mcvittie, J. P.

MRS - Materials Research Society
9 Conference Proceedings 310e. Simulation of Profile Evolution In Shallow Trench Formation by Plasma Etching

John Hoang, Jane P. Chang

American Institute of Chemical Engineers
4 Conference Proceedings The Effect of Ion Heating on the Angular Distributions in Plasma Etching Processes

Zheng, J., McVittie, J.P.

Electrochemical Society
10 Conference Proceedings Practical Applications of in-situ Plasma-Etching Diagnostic Techniques

Thomas,D.J., Southworth,P., Flowers,M.C., Dartnell,N.J., Greef,R., Liu,Y.

Trans Tech Publications
5 Conference Proceedings CHARGING EFFECTS ON ION TRAJECTORIES IN PLASMA ETCHING

Murakawa, S., Fang, S., McVittie, J.P.

Electrochemical Society
11 Conference Proceedings Etching of Vias and Trenches through Low-k Dielectrics with Feature Sizes down to 0.1 um Using MORI High Density Plasmas

Thomas, D.J., Song, Y.P., Powell, K., Fragos, C., Watson, A.

Electrochemical Society
6 Conference Proceedings Modeling of Notching Caused by Aspect Ratio Dependent Charging During High Density Plasma Etching

Hane, M., Kinoshita, T., McVittie, J.P.

Electrochemical Society
12 Conference Proceedings A New Probe for Direct Measurement of Surface Charging

McVittie, J.P., Murakawa, S.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12