*AN OVERVIEW OF MATERIALS SCIENCES IN PRINTED CIRCUIT PACKAGING

*AN OVERVIEW OF MATERIALS SCIENCES IN PRINTED CIRCUIT PACKAGING

Author(s):

Publication title:

Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

40

Pub. Year:

1985

Page(from):

21

Page(to):

48

Pages:

28

Pub. info.:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9780931837050 [0931837057]

Language:

English

Call no.:

M23500/40

Type:

Conference Proceedings

Details

TDL ID:	ZA00015526
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	1984
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1984.11.26-1984.11.28

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