*MATERIALS SCIENCE AND PROCESSING, THE FOUNDATIONS OF PACKING

*MATERIALS SCIENCE AND PROCESSING, THE FOUNDATIONS OF PACKING

Author(s):: Eastman, Dean E.
Publication title:: Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A.
Title of ser.:: Materials Research Society symposium proceedings
Ser. no.:: 40
Pub. Year:: 1985
Page(from):: 3
Page(to):: 6
Pages:: 4
Pub. info.:: Pittsburgh, Pa.: Materials Research Society
ISSN:: 02729172
ISBN:: 9780931837050 [0931837057]
Language:: English
Call no.:: M23500/40
Type:: Conference Proceedings

Details

TDL ID:	ZA00015526
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	1984
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1984.11.26-1984.11.28

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