New SOI devices transferred onto fused silica by direct wafer bonding
- Author(s):
Lagahe-Blanchard, C. Aspar, B. Paillet, P. Ferlet-Cavois, V. Fel, N. Pavageau, C. du Port de Poncharra, J. Moriceau, H. - Publication title:
- Silicon-on-insulator technology and devices XII : proceedings of the international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2005-03
- Pub. Year:
- 2005
- Page(from):
- 237
- Page(to):
- 242
- Pages:
- 6
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774611 [1566774616]
- Language:
- English
- Call no.:
- E23400/200503
- Type:
- Conference Proceedings
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