A Comparison Study of MPSA-Cl-PEG and SPS-Cl-PEG Additive Systems for Copper Electrodeposition

A Comparison Study of MPSA-Cl-PEG and SPS-Cl-PEG Additive Systems for Copper Electrodeposition

Author(s):

Publication title:

Electrochemical processes in ULSI and MEMS : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2004-17

Pub. Year:

2005

Page(from):

34

Page(to):

40

Pages:

7

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774727 [1566774721]

Language:

English

Call no.:

E23400/200417

Type:

Conference Proceedings

Details

TDL ID:	ZA00015410
Series ID:	PA00000028
Conf. info. (Name):	Symposium on Electrochemical Processes in ULSI and MEMS ; Spring Meeting of the Electrochemical Society
Conf. info. (Number):	2004 ; 205th
Conf. info. (Venue):	San Antonio, TX, USA
Conf. info. (Date):	2004.00.00

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