Blank Cover Image

Silicon Wafer Bonding Using Deposited and Thermal Oxides: A Comparative Study

Author(s):
Radu, I.
Singh, R.
Reiche, M.
Gosele U.
Kuck, B.
Grabolla, T.
Tillack, B.
Christiansen, S.
3 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. Year:
2005
Page(from):
400
Page(to):
405
Pages:
6
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Wafer Bonding and Layer Transfer Approach for Strained Silicon-on-Insulator(SSOI) Fabrication

Singh, R., Radu, I., Reiche, M., Gosele, U., Christiansen, S.H., Webb, D.

Electrochemical Society
7 Conference Proceedings Dislocation Networks Formed by Silicon Wafer Direct Bonding

M. Reiche

Trans Tech Publications
2 Conference Proceedings Comparison of SiGe Virtual Substrates for the Fabrication of Strained Silicon-on-Insulator (sSOI) Using Wafer Bonding and Layer Transfer

M. Reiche, I. Radu, C. Himcinschi, R. Singh, S. Christiansen

Electrochemical Society
8 Conference Proceedings Interface Defects of Bonded Silicon Wafers

Reiche,M., Tong,Q.-Y., Gosele,U., Heydenreich,J.

Trans Tech Publications
3 Conference Proceedings (11.4) 4:20 - 4:40 PM - Strained Silicon on Insulator (sSOI) by Wafer Bonding

Christiansen, S., Reiche, M., Radu, I., Singh, R., Gosele, U., Webb, D., Mantl, S. (Max Planck Institute …

Electrochemical Society
9 Conference Proceedings Strained Silicon-On-Insulator - Fabrication and Characterization

M. Reiche, C. Himcinschi, U. Gösele, S. Christiansen, S. Mantl, D. Buca, Q. Zhao, S. Feste, R. Loo, D. Nguyen, W. …

Electrochemical Society
4 Conference Proceedings Wafer Bonding for Optical MEMS

Bakke, T., Volker, B., Schenk, H., Radu, I., Reiche, M.

Electrochemical Society
10 Conference Proceedings Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding

Bakke, T., Friedrichs, M., Volker, B., Reiche, M., Leonardsson, L., Schenk, H., Lakner, H.K.

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Low-Temperature Wafer Bonding via DBD Surface Activation

Radu, I., Reiche, M., Zoberbier, M., Gabriel, M., Gosele, U.

Electrochemical Society
11 Conference Proceedings Strained Silicon on Wafer Level by Waferbonding: Materials Processing, Strain Measurements and Strain Relaxation

M. Reiche, O. Moutanabbir, C. Himcinschi, S. Christiansen, W. Erfurth

Electrochemical Society
6 Conference Proceedings Capabilities of an Ambient Pressure Plasma for Activation in LT Wafer Bonding Processes

Gabriel, M., Cetin, V., Hansen, S., Reiche, M., Radu, I., Eichler, M.

Electrochemical Society
12 Conference Proceedings Ferroelectric Oxide Single-Crystalline Layers by Wafer Bonding and Hydrogen/Helium Implantation

Radu, Ionut, Szafraniak, Izabela, Scholz, Roland, Alexe, Marin, Gosele, Ulrich

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12