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Wafer Bonding and Layer Transfer Approach for Strained Silicon-on-Insulator(SSOI) Fabrication

Author(s):
Singh, R.
Radu, I.
Reiche, M.
Gosele, U.
Christiansen, S.H.
Webb, D.
1 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. Year:
2005
Page(from):
89
Page(to):
95
Pages:
7
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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