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Capabilities of an Ambient Pressure Plasma for Activation in LT Wafer Bonding Processes

Author(s):
Gabriel, M.
Cetin, V.
Hansen, S.
Reiche, M.
Radu, I.
Eichler, M.
1 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. Year:
2005
Page(from):
50
Page(to):
57
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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