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Simulation of Thermoset Injection Molding

Author(s):
  • Chiu, H. ( Ohio State University, Columbus, OH )
  • Chen, S. ( Ohio State University, Columbus, OH )
  • Lee, L. ( Ohio State University, Columbus, OH )
Publication title:
AIChE ANNUAL MEETING - NOVEMBER 10-15, 1996 - CHICAGO, IL
Title of ser.:
AIChE meeting [papers]
Ser. no.:
1996
Pub. Year:
1996
Paper no.:
27g
Pages:
4
Pub. info.:
New York: American Institute of Chemical Engineers
Language:
English
Call no.:
A08000
Type:
Conference Proceedings

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