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Bond enhance of hydroxyapatite/silicon layers by introducing a porous silicon interlayer

Author(s):
Chen, S. ( East China Normal Univ. (China) )
Zhu, J. ( East China Normal Univ. (China) )
Zhang, J. ( East China Normal Univ. (China) )
Feng, X. ( East China Normal Univ. (China) )
Shi, Y. ( East China Normal Univ. (China) )
Wang, X. ( East China Normal Univ. (China) )
Luo, L. ( East China Normal Univ. (China) )
Zhu, Z. ( East China Normal Univ. (China) )
3 more
Publication title:
Fifth International Conference on Thin Film Physics and Applications : 31 May-2 June, 2004, Shanghai, China
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5774
Pub. Year:
2004
Page(from):
559
Page(to):
562
Pages:
4
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457554 [0819457558]
Language:
English
Call no.:
P63600/5774
Type:
Conference Proceedings

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