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SiCN and Ta/TaN barriers for Cu/ultralow-k integration in 0.13-pm technology

Author(s):
  • Yang, L. Y. ( Nanyang Technological Univ. (Singapore) )
  • Zhang, D. H. ( Nanyang Technological Univ. (Singapore) )
  • Li, C. Y. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) )
  • Lu, P. ( Institute of Microelectronics (Singapore) )
  • Foo, P. D. ( Institute of Microelectronics (Singapore) )
Publication title:
Fifth International Conference on Thin Film Physics and Applications : 31 May-2 June, 2004, Shanghai, China
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5774
Pub. Year:
2004
Page(from):
454
Page(to):
457
Pages:
4
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457554 [0819457558]
Language:
English
Call no.:
P63600/5774
Type:
Conference Proceedings

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