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Process-window sensitive full-chip inspection for design-to-silicon optimization in the sub-wavelength era

Author(s):
Brodsky, M. J. ( IBM Microelectronics Div. (USA) )
Halle, S. ( IBM Microelectronics Div. (USA) )
Jophlin-Gut, V. ( IBM Microelectronics Div. (USA) )
Liebmann, L. ( IBM Microelectronics Div. (USA) )
Samuels, D. ( IBM Microelectronics Div. (USA) )
Crispo, G. ( KLA-Tencor Corp. (USA) )
Nafisi, K. ( KLA-Tencor Corp. (USA) )
Ramani, V. ( KLA-Tencor Corp. (USA) )
Peterson, I. ( KLA-Tencor Corp. (USA) )
4 more
Publication title:
Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5756
Pub. Year:
2005
Page(from):
51
Page(to):
60
Pages:
10
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457363 [0819457361]
Language:
English
Call no.:
P63600/5756
Type:
Conference Proceedings

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