Optimization of multi-pole aperture for via patterning of 90 nm logic devices by KrF lithography

Optimization of multi-pole aperture for via patterning of 90 nm logic devices by KrF lithography

Author(s):

Fang, S. P. ( United Microelectronics Corp. (Taiwan) )

Yang, H. ( United Microelectronics Corp. (Taiwan) )

Chang, H. ( United Microelectronics Corp. (Taiwan) )

Chiang, P. ( United Microelectronics Corp. (Taiwan) )

Lin, B. S.-M. ( United Microelectronics Corp. (Taiwan) )

Hung, K.-C. ( United Microelectronics Corp. (Taiwan) )

1 more

Publication title:

Optical microlithography XVIII : 1-4 March, 2005, San Jose, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5754

Pub. Year:

2005

Pt.:

3

Page(from):

1367

Page(to):

1376

Pages:

10

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819457349 [0819457345]

Language:

English

Call no.:

P63600/5754

Type:

Conference Proceedings

Details

TDL ID:	ZA00014979
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in resist technology and processing
Conf. info. (Number):	2005 : 18th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2005.03.01-2005.03.04
Note for article:	18th Optical microlithography,1-4 March, 2005, San Jose, California, USA

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