The effect of film thickness on the dissolution rate and hydrogen bonding behavior of photoresist polymer thin films

The effect of film thickness on the dissolution rate and hydrogen bonding behavior of photoresist polymer thin films

Author(s):

Kim, J.-B. ( Korea Advanced Institute of Science and Technology (South Korea) )
Park, J.-Y. ( Korea Advanced Institute of Science and Technology (South Korea) )

Publication title:

Advances in resist technology and processing XXII : 28 February-2 March, 2005, San Jose, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5753(1)

Pub. Year:

2005

Pt.:

1

Page(from):

319

Page(to):

328

Pages:

10

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819457332 [0819457337]

Language:

English

Call no.:

P63600/5753-1

Type:

Conference Proceedings

Details

TDL ID:	ZA00014977
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Metrology, Inspection, and Process Control for Microlithography
Conf. info. (Number):	2005 : 22th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2005.02.28-2005.03.02

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