Progress toward board-level optical interconnect technology (Invited Paper)
- Author(s):
Moynihan, M.L. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Sicard, B. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Ho, T. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Little, L. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Pugliano, N. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Shelnut, J.G. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Zheng, H.B. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Knudsen, P. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Lundy, D. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Chiarotto, N. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Lustig, C. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) Allen, C. ( Rohm and Haas Electronic Materials, L.L.C. (USA) ) - Publication title:
- Photonics Packaging and Integration V
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5731
- Pub. Year:
- 2005
- Page(from):
- 50
- Page(to):
- 62
- Pages:
- 13
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819457059 [0819457051]
- Language:
- English
- Call no.:
- P63600/5731
- Type:
- Conference Proceedings
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